This project investigated a recently patented Sandia technology known as visible light Laser Voltage Probing (LVP). In this effort we carefully prepared well understood and characterized samples for testing. These samples were then operated across a range of configurations to minimize the possibility of superposition of multiple photon carrier interactions as data was taken with conventional and visible light LVP systems. Data consisted of LVP waveforms and Laser Voltage Images (LVI). Visible light (633 nm) LVP data was compared against 1319 nm and 1064 nm conventional LVP data to better understand the similarities and differences in mechanisms for all wavelengths of light investigated. The full text can be obtained by reaching the project manager, Ed Cole or the Cyber IA lead, Justin Ford.
Visible light laser voltage probing (LVP) for improved backside optical spatial resolution is demonstrated on ultra-thinned samples. A prototype system for data acquisition, a method to produce ultra-thinned SOI samples, and LVP signal, imaging, and waveform acquisition are described on early and advanced SOI technology nodes. Spatial resolution and signal comparison with conventional, infrared LVP analysis is discussed.
The burgeoning new technology of Micro-Electro-Mechanical Systems (MEMS) shows great promise in the weapons arena. We can now conceive of micro-gyros, micro-surety systems, and micro-navigators that are extremely small and inexpensive. Do we want to use this new technology in critical applications such as nuclear weapons? This question drove us to understand the reliability and failure mechanisms of silicon surface-micromachined MEMS. Development of a testing infrastructure was a crucial step to perform reliability experiments on MEMS devices and will be reported here. In addition, reliability test structures have been designed and characterized. Many experiments were performed to investigate failure modes and specifically those in different environments (humidity, temperature, shock, vibration, and storage). A predictive reliability model for wear of rubbing surfaces in microengines was developed. The root causes of failure for operating and non-operating MEMS are discussed. The major failure mechanism for operating MEMS was wear of the polysilicon rubbing surfaces. Reliability design rules for future MEMS devices are established.