D03-0658: (Invited) Through-Silicon Via Copper Plating and Endpoint Detection Schmitt, Rebecca P.; Perez, Carlos P.; Gonzales Kirkpatrick, Cielo M.; McClain, Jaime L.; McDow, Jessica M.; Jordan, Matthew J.; Baca, Ehren B.; Hollowell, Andrew E. Abstract not provided. More Details TYPE Conference Presenation YEAR 2021 OSTIDOI
Copper Electrodeposition in Through Sillicon Vias: Scaling from Die Level to Wafer Level Plating McDow, Jessica M.; Schmitt, Rebecca P.; Hirabayashi, Mieko H.; Baca, Ehren B.; Menk, Lyle A.; Hollowell, Andrew E.; Jordan, Matthew J. Abstract not provided. More Details TYPE Conference Presenation YEAR 2021 OSTIDOI
Cu ECD in High Aspect Ratio Mesoscale TSVs: Scaling from Die Level to Wafer Level Plating Schmitt, Rebecca P.; Menk, Lyle A.; Jordan, Matthew J.; Christopher, Jason C.; Baca, Ehren B.; McDow, Jessica M.; Jackson, Nathan J.; Hollowell, Andrew E. Abstract not provided. More Details TYPE Conference Poster YEAR 2020 OSTI
Evaluating Surface Tension Self-Alignment of Flip Chip Bonded Die Hollowell, Andrew E.; McDow, Jessica M.; McClain, Jaime L.; Young, Andrew I.; Dallo, Henry J. Abstract not provided. More Details TYPE Conference Poster YEAR 2019 OSTI