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Characterization of Switching Filament Formation in TaOx Memristive Memory Films

Marinella, Matthew J.; Marinella, Matthew J.; Howell, Stephen W.; Howell, Stephen W.; Decker, Seth D.; Decker, Seth D.; Hughart, David R.; Hughart, David R.; Lohn, Andrew L.; Lohn, Andrew L.; Mickel, Patrick R.; Mickel, Patrick R.; Apodaca, Roger A.; Apodaca, Roger A.; Bielejec, Edward S.; Bielejec, Edward S.; Beechem, Thomas E.; Beechem, Thomas E.; Wolfley, Steven L.; Wolfley, Steven L.; Stevens, James E.; Brennecka, Geoffrey L.

Abstract not provided.

Development characterization and modeling of a TaOx ReRAM for a neuromorphic accelerator

Marinella, Matthew J.; Mickel, Patrick R.; Lohn, Andrew L.; Hughart, David R.; Bondi, Robert J.; Mamaluy, Denis M.; Hjalmarson, Harold P.; Stevens, James E.; Decker, Seth D.; Apodaca, Roger A.; Evans, Brian R.; Aimone, James B.; Rothganger, Fredrick R.; James, Conrad D.; DeBenedictis, Erik

This report discusses aspects of neuromorphic computing and how it is used to model microsystems.

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Rutherford forward scattering and elastic recoil detection (RFSERD) as a method for characterizing ultra-thin films

Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms

Lohn, Andrew J.; Doyle, Barney L.; Stein, Gregory J.; Mickel, Patrick R.; Stevens, James E.; Marinella, Matthew J.

We present a novel ion beam analysis technique combining Rutherford forward scattering and elastic recoil detection (RFSERD) and demonstrate its ability to increase efficiency in determining stoichiometry in ultrathin (5-50 nm) films as compared to Rutherford backscattering. In the conventional forward geometries, scattering from the substrate overwhelms the signal from light atoms but in RFSERD, scattered ions from the substrate are ranged out while forward scattered ions and recoiled atoms from the thin film are simultaneously detected in a single detector. The technique is applied to tantalum oxide memristors but can be extended to a wide range of materials systems. © 2014 Published by Elsevier B.V.

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Technology for On-Chip Qubit Control with Microfabricated Surface Ion Traps

Highstrete, Clark H.; Sterk, Jonathan D.; Heller, Edwin J.; Maunz, Peter L.; Nordquist, Christopher N.; Stevens, James E.; Tigges, Chris P.; Blain, Matthew G.

Trapped atomic ions are a leading physical system for quantum information processing. However, scalability and operational fidelity remain limiting technical issues often associated with optical qubit control. One promising approach is to develop on-chip microwave electronic control of ion qubits based on the atomic hyperfine interaction. This project developed expertise and capabilities at Sandia toward on-chip electronic qubit control in a scalable architecture. The project developed a foundation of laboratory capabilities, including trapping the 171Yb+ hyperfine ion qubit and developing an experimental microwave coherent control capability. Additionally, the project investigated the integration of microwave device elements with surface ion traps utilizing Sandia’s state-of-the-art MEMS microfabrication processing. This effort culminated in a device design for a multi-purpose ion trap experimental platform for investigating on-chip microwave qubit control, laying the groundwork for further funded R&D to develop on-chip microwave qubit control in an architecture that is suitable to engineering development.

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A CMOS Compatible, Forming Free TaOx ReRAM

ECS Transactions (Online)

Stevens, James E.; Mickel, Patrick R.; Hughart, David R.; Marinella, Matthew J.

Resistive random access memory (ReRAM) has become a promising candidate for next-generation high-performance non-volatile memory that operates by electrically tuning resistance states via modulating vacancy concentrations. Here, we demonstrate a wafer-scale process for resistive switching in tantalum oxide that is completely CMOS compatible. The resulting devices are forming-free and with greater than 1x105 cycle endurance.

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Advanced atom chips with two metal layers

Blain, Matthew G.; Biedermann, Grant B.; Benito, Francisco M.; Stevens, James E.

A design concept, device layout, and monolithic microfabrication processing sequence have been developed for a dual-metal layer atom chip for next-generation positional control of ultracold ensembles of trapped atoms. Atom chips are intriguing systems for precision metrology and quantum information that use ultracold atoms on microfabricated chips. Using magnetic fields generated by current carrying wires, atoms are confined via the Zeeman effect and controllably positioned near optical resonators. Current state-of-the-art atom chips are single-layer or hybrid-integrated multilayer devices with limited flexibility and repeatability. An attractive feature of multi-level metallization is the ability to construct more complicated conductor patterns and thereby realize the complex magnetic potentials necessary for the more precise spatial and temporal control of atoms that is required. Here, we have designed a true, monolithically integrated, planarized, multi-metal-layer atom chip for demonstrating crossed-wire conductor patterns that trap and controllably transport atoms across the chip surface to targets of interest.

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Multi-frequency aluminum nitride micro-filters for advanced RF communications

Olsson, Roy H.; Wojciechowski, Kenneth W.; Tuck, Melanie R.; Stevens, James E.; Nordquist, Christopher N.

An AlN MEMS resonator technology has been developed, enabling massively parallel filter arrays on a single chip. Low-loss filter banks covering the 10 MHz--10-GHz frequency range have been demonstrated, as has monolithic integration with inductors and CMOS circuitry. The high level of integration enables miniature multi-bandm spectrally aware, and cognitive radios.

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Microresonant impedance transformers

Proceedings - IEEE Ultrasonics Symposium

Olsson, Roy H.; Wojciechowski, Kenneth W.; Tuck, Melanie R.; Stevens, James E.

Widely applied to RF filtering, AlN microresonators offer the ability to perform additional functions such as impedance matching and single-ended-to- differential conversion. This paper reports microresonators capable of transforming the characteristic impedance from input to output over a wide range while performing low loss filtering. Microresonant transformer theory of operation and equivalent circuit models are presented and compared with measured 2 and 3-Port devices. Impedance transformation ratios as large as 18:1 are realized with insertion losses less than 5.8 dB, limited by parasitic shunt capacitance. These impedance transformers occupy less than 0.052 mm2, orders of magnitude smaller than competing technologies in the VHF and UHF frequency bands. ©2009 IEEE.

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Si-based RF MEMS components

Dyck, Christopher D.; Stewart, Harold D.; Fleming, J.G.; Stevens, James E.; Nordquist, Christopher N.

Radio frequency microelectromechanical systems (RF MEMS) are an enabling technology for next-generation communications and radar systems in both military and commercial sectors. RF MEMS-based reconfigurable circuits outperform solid-state circuits in terms of insertion loss, linearity, and static power consumption and are advantageous in applications where high signal power and nanosecond switching speeds are not required. We have demonstrated a number of RF MEMS switches on high-resistivity silicon (high-R Si) that were fabricated by leveraging the volume manufacturing processes available in the Microelectronics Development Laboratory (MDL), a Class-1, radiation-hardened CMOS manufacturing facility. We describe novel tungsten and aluminum-based processes, and present results of switches developed in each of these processes. Series and shunt ohmic switches and shunt capacitive switches were successfully demonstrated. The implications of fabricating on high-R Si and suggested future directions for developing low-loss RF MEMS-based circuits are also discussed.

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35 Results
35 Results