Publications

Charge trapping and slow (10 s to > 1000 s) detrapping in AlGaN/GaN HEMTs designed for high breakdown voltage (> 1500 V) are studied to identify the impact of Al molefraction and passivation on trapping. Two different trapping components, TG1 (E a = 0.62 eV) and TG2 (with negligible temperature dependence) in AlGaN dominate under gale bias stress in the off-state. Al 0.15Ga 0.85N shows much more vulnerability to trapping under gate stress in the absence of passivation than does AlGaN with a higher Al mole fraction. Under large drain bias, trapping is dominated by a much deeper trap TD. Detrapping under illumination by monochromatic light shows TD to have E a ≈ 1.65 eV in Al 0.26Ga 0.74N and E a ≈ 1.85 eV in Al 0.15Ga 0.85N. This is consistent with a transition from a deep state (E c - 2.0 eV) in the AlGaN barrier to the 2DEG. © 2012 Materials Research Society.

Charge trapping and slow (from 10 s to > 1000 s) detrapping in AlGaN/GaN high electron mobility transistors (HEMTs) designed for high breakdown voltages (> 1500 V) is studied through a combination of electrical, thermal, and optical methods to identify the impact of Al molefraction and passivation on trapping. Trapping due to 5-10 V drain bias stress in the on-state (V gs = 0) is found to have significantly slower recovery, compared with trapping in the off-state (V gs < V th, V ds = 0). Two different trapping components, i.e., TG1 (E a = 0.6 eV) and TG2 (with negligible temperature dependence), in AlGaN dominate under gate bias stress in the off-state. Al 0.15 Ga 0.85N shows much more vulnerability to trapping under gate stress in the absence of passivation than does AlGaN with a higher Al mole fraction. Under large drain bias, trapping is dominated by a much deeper trap TD. Detrapping under monochromatic light shows TD to have E a ≈ 1.65 eV. Carbon doping in the buffer is shown to introduce threshold voltage shifts, unlike any of the other traps. © 2012 IEEE.

Abstract not provided.

Abstract not provided.

Abstract not provided.

The project's goals are: (1) use experiments and modeling to investigate and characterize stress-related failure modes of post-silicon power electronic (PE) devices such as silicon carbide (SiC) and gallium nitride (GaN) switches; and (2) seek opportunities for condition monitoring (CM) and prognostics and health management (PHM) to further enhance the reliability of power electronics devices and equipment. CM - detect anomalies and diagnose problems that require maintenance. PHM - track damage growth, predict time to failure, and manage subsequent maintenance and operations in such a way to optimize overall system utility against cost. The benefits of CM/PHM are: (1) operate power conversion systems in ways that will preclude predicted failures; (2) reduce unscheduled downtime and thereby reduce costs; and (3) pioneering reliability in SiC and GaN.