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Outstanding conference paper award 2014 IEEE nuclear and space radiation effects conference

IEEE Transactions on Nuclear Science

Dodds, Nathaniel A.; Dodds, Nathaniel A.; Schwank, James R.; Schwank, James R.; Shaneyfelt, Marty R.; Shaneyfelt, Marty R.; Dodd, Paul E.; Dodd, Paul E.; Doyle, Barney L.; Doyle, Barney L.; Trinczek, M.C.; Trinczek, M.C.; Blackmore, E.W.; Blackmore, E.W.; Rodbell, K.P.; Rodbell, K.P.; Reed, R.A.; Reed, R.A.; Pellish, J.A.; Pellish, J.A.; LaBel, K.A.; LaBel, K.A.; Marshall, P.W.; Marshall, P.W.; Swanson, Scot E.; Swanson, Scot E.; Vizkelethy, Gyorgy V.; Vizkelethy, Gyorgy V.; Van Deusen, Stuart B.; Van Deusen, Stuart B.; Sexton, Frederick W.; Sexton, Frederick W.; Martinez, Marino M.; Martinez, Marino M.

The recipients of the 2014 NSREC Outstanding Conference Paper Award are Nathaniel A. Dodds, James R. Schwank, Marty R. Shaneyfelt, Paul E. Dodd, Barney L. Doyle, Michael Trinczek, Ewart W. Blackmore, Kenneth P. Rodbell, Michael S. Gordon, Robert A. Reed, Jonathan A. Pellish, Kenneth A. LaBel, Paul W. Marshall, Scot E. Swanson, Gyorgy Vizkelethy, Stuart Van Deusen, Frederick W. Sexton, and M. John Martinez, for their paper entitled "Hardness Assurance for Proton Direct Ionization-Induced SEEs Using a High-Energy Proton Beam." For older CMOS technologies, protons could only cause single-event effects (SEEs) through nuclear interactions. Numerous recent studies on 90 nm and newer CMOS technologies have shown that protons can also cause SEEs through direct ionization. Furthermore, this paper develops and demonstrates an accurate and practical method for predicting the error rate caused by proton direct ionization (PDI).

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Hardness assurance for proton direct ionization-induced SEEs using a high-energy proton beam

IEEE Transactions on Nuclear Science

Dodds, N.A.; Schwank, James R.; Shaneyfelt, Marty R.; Dodd, Paul E.; Doyle, Barney L.; Trinczek, M.; Blackmore, E.W.; Rodbell, K.P.; Gordon, M.S.; Reed, R.A.; Pellish, J.A.; LaBel, K.A.; Marshall, P.W.; Swanson, Scot E.; Vizkelethy, Gyorgy V.; Van Deusen, Stuart B.; Sexton, Frederick W.; Martinez, Marino M.

The low-energy proton energy spectra of all shielded space environments have the same shape. This shape is easily reproduced in the laboratory by degrading a high-energy proton beam, producing a high-fidelity test environment. We use this test environment to dramatically simplify rate prediction for proton direct ionization effects, allowing the work to be done at high-energy proton facilities, on encapsulated parts, without knowledge of the IC design, and with little or no computer simulations required. Proton direct ionization (PDI) is predicted to significantly contribute to the total error rate under the conditions investigated. Scaling effects are discussed using data from 65-nm, 45-nm, and 32-nm SOI SRAMs. These data also show that grazing-angle protons will dominate the PDI-induced error rate due to their higher effective LET, so PDI hardness assurance methods must account for angular effects to be conservative. We show that this angular dependence can be exploited to quickly assess whether an IC is susceptible to PDI.

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SEGR in SiO${}_2$ –Si$_3$ N$_4$ Stacks

IEEE Transactions on Nuclear Science

Schwank, James R.; Shaneyfelt, Marty R.

This work presents experimental SEGR data for MOS-devices, where the gate dielectrics are are made of stacked SiO2–Si3N4 structures. Also a semi-empirical model for predicting the critical gate voltage in these structures under heavy-ion exposure is proposed. Then statistical interrelationship between SEGR cross-section data and simulated energy deposition probabilities in thin dielectric layers is discussed.

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SOI substrate removal for SEE characterization: Techniques and applications

IEEE Transactions on Nuclear Science

Shaneyfelt, Marty R.; Schwank, James R.; Dodd, Paul E.; Stevens, Jeffrey S.; Vizkelethy, Gyorgy; Swanson, Scot E.; Dalton, Scott M.

Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated. © 2012 IEEE.

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Hardness assurance testing for proton direct ionization effects

Proceedings of the European Conference on Radiation and its Effects on Components and Systems, RADECS

Schwank, James R.; Shaneyfelt, Marty R.; Ferlet-Cavrois, Véronique; Dodd, Paul E.; Blackmore, Ewart W.; Pellish, Jonathan A.; Rodbell, Kenneth P.; Heidel, David F.; Marshall, Paul W.; LaBel, Kenneth A.; Gouker, Pascale M.; Tam, Nelson; Wong, Richard; Wen, Shi J.; Reed, Robert A.; Dalton, Scott M.; Swanson, Scot E.

The potential for using the degraded beam of high-energy proton radiation sources for proton hardness assurance testing for ICs that are sensitive to proton direct ionization effects are explored. SRAMs were irradiated using high energy proton radiation sources (∼67-70 MeV). The proton energy was degraded using plastic or Al degraders. Peaks in the SEU cross section due to direct ionization were observed. To best observe proton direct ionization effects, one needs to maximize the number of protons in the energy spectrum below the proton energy SEU threshold. SRIM simulations show that there is a tradeoff between increasing the fraction of protons in the energy spectrum with low energies by decreasing the peak energy and the reduction in the total number of protons as protons are stopped in the device as the proton energy is decreased. Two possible methods for increasing the number of low energy protons is to decrease the primary proton energy to reduce the amount of energy straggle and to place the degrader close to the DUT to minimize angular dispersion. These results suggest that high-energy proton radiation sources may be useful for identifying devices sensitive to proton direct ionization. © 2011 IEEE.

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Dosimetry experiments at the MEDUSA Facility (Little Mountain)

Harper-Slaboszewicz, V.H.; Hartman, Elmer F.; Shaneyfelt, Marty R.; Schwank, James R.; Sheridan, Timothy J.

A series of experiments on the MEDUSA linear accelerator radiation test facility were performed to evaluate the difference in dose measured using different methods. Significant differences in dosimeter-measured radiation dose were observed for the different dosimeter types for the same radiation environments, and the results are compared and discussed in this report.

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Effects of moisture on radiation-induced degradation in CMOS SOI transistors

IEEE Transactions on Nuclear Science

Shaneyfelt, Marty R.; Schwank, James R.; Dodd, Paul E.; Hill, Thomas A.; Dalton, Scott M.; Swanson, Scot E.

The effects of moisture on radiation-induced charge buildup in the oxides of a 0.35 μSOI technology are explored. Data show no observable effects of moisture-related aging on radiation hardness. These results are in contrast to those of previous work performed on bulk MOS technologies fabricated in the 1980s. The cause of these differences do not appear to be due to differences in final chip passivation layers. Instead, other processing variables (e.g., thicker overlayers) may account for these differences. In any case, the SOI technology results indicate that not all advanced technologies exposed to moisture are necessarily susceptible to enhanced radiation-induced degradation. © 2010 IEEE.

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Hardness assurance test guideline for qualifying devices for use in proton environments

IEEE Transactions on Nuclear Science

Schwank, James R.; Shaneyfelt, Marty R.; Dodd, Paul E.; Felix, James A.; Baggio, J.; Ferlet-Cavrois, V.; Paillet, P.; Label, K.A.; Pease, R.L.; Simons, M.; Cohn, L.M.

Proton-induced singl -event effects hardness assurance guidelines are developed to address issues raised by recent test results in advanced IC technologies for use in space environments. Specifically, guidelines are developed that address the effects of proton energy and angle of incidence on single-event latchup and the effects of total dose on single-event upset. The guidelines address both single-event upset (SEU), single-event latchup (SEL), and combined SEU and total ionizing dose (TID) effects. © 2006 IEEE.

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Analysis of proton and heavy-ion irradiation effects on phase change memories with MOSFET and BJT selectors

IEEE Transactions on Nuclear Science

Gasperin, Alberto; Paccagnella, Alessandro; Schwank, James R.; Vizkelethy, Gyorgy; Ottogalli, Federica; Pellizzer, Fabio

We study proton and heavy ion irradiation effects on Phase Change Memories (PCM) with MOSFET and BJT selectors and the effect of the irradiation on the retention characteristics of these devices. Proton irradiation produces noticeable variations in the cell distributions in PCM with MOSFET selectors mostly due to leakage currents affecting the transistors. PCM with BJT selectors show only small variations after proton irradiation. PCM cells do not appear to be impacted by heavy-ion irradiation. Using high temperature accelerated retention tests, we demonstrate that the retention capability of these memories is not compromised by the irradiation. © 2006 IEEE.

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Results 1–50 of 101
Results 1–50 of 101