Fabrication techniques for heterogenous integration of 2.5-D Systems
Abstract not provided.
Publications
Failure Analysis and Process Verification of High Density Copper ICs
Abstract not provided.
Failure analysis and process verification of high density copper ICs used in multi-chip modules (MCM)
Conference Proceedings from the International Symposium for Testing and Failure Analysis
Manufacturing of integrated circuits (ICs) using a split foundry process expands design space in IC fabrication by employing unique capabilities of multiple foundries and provides added security for IC designers [1] Defect localization and root cause analysis is critical to failure identification and implementation of corrective actions. In addition to split-foundry fabrication, the device addressed in this publication is .comprised of 8 metal layers, aluminum test pads, and tungsten thru-silicon vias (TSVs) making the circuit area > 68% metal. This manuscript addresses the failure analysis efforts involved in root cause analysis, failure analysis findings, and the corrective actions implemented to eliminate these failure mechanisms from occurring in future product.
3 Results