A new approach to explosive sample preparation is described in which microelectronics-related processing techniques are utilized. Fused silica and alumina substrates were prepared utilizing laser machining. Films of PETN were deposited into channels within the substrates by physical vapor deposition. Four distinct explosive behaviors were observed with high-speed framing photography by driving the films with a donor explosive. Initiation at hot spots was directly observed, followed by either energy dissipation leading to failure, or growth to a detonation. Unsteady behavior in velocity and structure was observed as reactive waves failed due to decreasing channel width. Mesoscale simulations were performed to assist in experiment development and understanding. We have demonstrated the ability to pattern these films of explosives and preliminary mesoscale simulations of arrays of voids showed effects dependent on void size and that detonation would not develop with voids below a certain size. Future work involves experimentation on deposited films with regular patterned porosity to elucidate mesoscale explosive behavior.