In this brief, the integration of a memristor with a microelectromechanical systems (MEMS) parallel plate capacitor coupled by an amplification stage is simulated. It is shown that the MEMS upper plate position can be controlled up to 95% of the total gap. Due to its common operation principle, the change in the MEMS plate position can be interpreted by the change in the memristor resistance or memristance. A memristance modulation of ∼1 kΩ was observed. A polynomial expression representing the MEMS upper plate displacement as a function of the memristance is presented. Thereafter, a simple design for a voltage closed-loop control is presented, showing that the MEMS upper plate can be stabilized up to 95% of the total gap by using the memristor as a feedback sensing element. The memristor can play important dual roles in overcoming the limited operation range of MEMS parallel plate capacitors and in simplifying read-out circuits of those devices by representing the motion of the upper plate in the form of resistance change instead of capacitance change.
This investigation examined the use of nano-patterned structures on Silicon-on-Insulator (SOI) material to reduce the bulk material melting point (1414 C). It has been found that sharp-tipped and other similar structures have a propensity to move to the lower energy states of spherical structures and as a result exhibit lower melting points than the bulk material. Such a reduction of the melting point would offer a number of interesting opportunities for bonding in microsystems packaging applications. Nano patterning process capabilities were developed to create the required structures for the investigation. One of the technical challenges of the project was understanding and creating the specialized conditions required to observe the melting and reshaping phenomena. Through systematic experimentation and review of the literature these conditions were determined and used to conduct phase change experiments. Melting temperatures as low as 1030 C were observed.
Over the last decade the successful design and fabrication of complex MEMS (MicroElectroMechanical Systems), optical circuits and ASICs have been demonstrated. Packaging and integration processes have lagged behind MEMS research but are rapidly maturing. As packaging processes evolve, a new challenge presents itself, microsystem product development. Product development entails the maturation of the design and all the processes needed to successfully produce a product. Elements such as tooling design, fixtures, gages, testers, inspection, work instructions, process planning, etc., are often overlooked as MEMS engineers concentrate on design, fabrication and packaging processes. Thorough, up-front planning of product development efforts is crucial to the success of any project.
This paper reports on the design, simulation, and preliminary testing of a three phase variable reluctance stepping motor. This motor is pancake-shaped with an overall outside diameter of 8 mm and a height of 3 mm. The outside diameter of the rotor is 4.7 mm. The rotor and stators occupy 2 mm of the height with the remaining 1 mm reserved for a 6:1 planetary gear reductor. The rotor and stators were constructed of Hyperco 50 using conventional miniature machining. The reductor was assembled using copper and PMMA (polymethylmethacrylate) components that were constructed using the LIGA (Lithographic Galvanoformung Abformung) microfabrication process. The maximum measured stall torque of the motor without the reductor is 0.47mNm at 4W and the maximum speed is 2,400 rpm.