Publications

Abstract not provided.

Gallium is incorporated into the strain-balanced In(Ga)As/InAsSb superlattice system to achieve the same mid-wave infrared cutoff tunability as conventional Ga-free InAs/InAsSb type-II superlattices, but with an additional degree of design freedom to enable optimization of absorption and transport properties. Time-resolved photoluminescence measurements of InGaAs/InAsSb superlattice characterization- and doped device structures are reported from 77 to 300 K and compared to InAs/InAsSb. The low-injection photoluminescence decay yields the minority carrier lifetime, which is analyzed with a recombination rate model, enabling the determination of the temperature-dependent Shockley-Read-Hall, radiative, and Auger recombination lifetimes and extraction of defect energy levels and capture cross section defect concentration products. The Shockley-Read-Hall-limited lifetime of undoped InGaAs/InAsSb is marginally reduced from 2.3 to 1.4 μs due to the inclusion of Ga; however, given that Ga improves the vertical hole mobility by a factor of >10×, a diffusion-limited InGaAs/InAsSb superlattice nBn could expect a lower bound of 2.5× improvement in diffusion length with significant impact on photodetector quantum efficiency and radiation hardness. At temperatures below 120 K, the doped device structures are Shockley-Read-Hall limited at 0.5 μs, which shows promise for detector applications.

An InGaAs/GaAsSb Type-II superlattice is explored as an absorber material for extended short-wave infrared detection. A 10.5 nm period was grown with an InGaAs/GaAsSb thickness ratio of 2 with a target In composition of 46% and target Sb composition of 62%. Cutoff wavelengths near 2.8 μm were achieved with responsivity beyond 3 μm. Demonstrated dark current densities were as low as 1.4 mA/cm2 at 295K and 13 μA/cm2 at 235K at -1V bias. A significant barrier to hole extraction was identified in the detector design that severely limited the external quantum efficiency (EQE) of the detectors. A redesign of the detector that removes that barrier could make InGaAs/GaAsSb very competitive with current commercial HgCdTe and extended InGaAs technology.

Abstract not provided.

Abstract not provided.

Characterization of vertical transport in semiconductor heterostructures is extremely difficult and often impractical. Measurements that are relatively straight forward in lateral transport using Hall methods, such as quantifying carrier density or mobility, have no analog in conventional vertical devices. Doppler charge velocimetry may provide an alternative approach to obtaining transport information. We hypothesize that we can drive vertical currents in structures like heterojunction bipolar transistors or nBn detectors, illuminate them with microwaves, and directly measure the carrier velocities through Doppler shifts imparted on the reflected microwave signal. Some challenges involve providing optical injection and working in the vertical geometry required to extract the desired information. While progress was made to this end, experiments have not yet proved successful. Implications for infrared material characterization are summarized at the end of this document.

Abstract not provided.

Al0.26Ga0.74N/GaN on SiC lateral Schottky diodes were fabricated with variable anode-to-cathode spacing and were analyzed for blocking and on-state device performance. On-chip normally-on High Electron Mobility Transistor (HEMT) structures were also fabricated for a comparison of blocking characteristics. The Schottky diode displayed an ideality factor of 1.59 with a Ni/AlGaN zero bias barrier height of 1.18 eV and a flat band barrier height of 1.59 eV. For anode-to-cathode spacings between 10 and 100 μm, an increase in median breakdown voltages from 529 V to 8519 V and median specific on-resistance (Ron-sp) from 1.5 to 60.7 mΩ cm2 was observed with an increase in spacing. The highest performing diode had a lateral figure of merit of 1.37 GW/cm2 corresponding to a breakdown voltage upwards of 9 kV and a Ron-sp of 59 mΩ cm2. This corresponds to the highest Schottky diode breakdown voltage reported thus far with an Al0.26Ga0.74N/GaN lateral structure.

AlGaN-channel high electron mobility transistors (HEMTs) are among a class of ultra wide-bandgap transistors that are promising candidates for RF and power applications. Long-channel Al_xGa_1-xN HEMTs with x = 0.7 in the channel have been built and evaluated across the -50°C to +200°C temperature range. These devices achieved room temperature drain current as high as 46 mA/mm and were absent of gate leakage until the gate diode forward bias turn-on at ~2.8 V, with a modest -2.2 V threshold voltage. A very large I_on/I_off current ratio, of 8 × 10⁹ was demonstrated. A near ideal subthreshold slope that is just 35% higher than the theoretical limit across the temperature range was characterized. The ohmic contact characteristics were rectifying from -50°C to +50°C and became nearly linear at temperatures above 100°C. An activation energy of 0.55 eV dictates the temperature dependence of off-state leakage.