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Fabrication of Wound Capacitors Using Flexible Alkali-Free Glass

IEEE Transactions on Components, Packaging and Manufacturing Technology

Wilke, Rudeger H.T.; Baker, Amanda; Brown-Shaklee, Harlan J.; Johnson, Raegan L.; Hettler, Chad H.; Murata, Takashi; O'Malley, Patrick D.; Perini, Steve; Lanagan, Michael

Alkali-free glasses, which exhibit high energy storage densities (~35 J/cc), present a unique opportunity to couple high temperature stability with high breakdown strength, and thus provide an avenue for capacitor applications with stringent temperature and power requirements. Realizing the potential of these materials in kilovolt class capacitors with >1 J/cc recoverable energy density requires novel packaging strategies that incorporate these extremely fragile dielectrics. In this paper, we demonstrate the feasibility of fabricating wound capacitors using 50-μm-thick glass. Two capacitors were fabricated from 2.8-m-long ribbons of thin (50 μm) glass wound into 125-140-mm-diameter spools. The capacitors exhibit a capacitance of 70-75 nF with loss tangents below 1%. The wound capacitors can operate up to 1 kV and show excellent temperature stability to 150 °C. By improving the end terminations, the self-resonance can be shifted to above 1 MHz, indicating that these materials may be useful for pulsed power applications with microsecond discharge times.

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Integrated power electronics using a ferrite%3CU%2B2010%3Ebased low%3CU%2B2010%3Etemperature co%3CU%2B2010%3Efired ceramic materials system

Schare, Joshua M.; Hettler, Chad H.

This paper discusses a new approach to making hybrid power electronic circuits by combining a low-temperature (850 C to 950 C) co-fired ceramic (LTCC) substrate, planar LTCC ferrite transformers/inductors and integrated passive components into a multilayer monolithic package using a ferrite-based LTCC material system. A ferrite tape functions as the base material for this LTCC system. The material system includes physically and chemically compatible dielectric paste, dielectric tape and conductor materials which can be co-fired with the base ferrite LTCC tape to create sintered devices with excellent magnetic coupling, high permeability ({approx}400), high resistivity (> 10{sup 12} {Omega} {center_dot} cm) and good saturation ({approx}0.3 T). The co-fired ferrite and dielectric materials can be used as a substrate for attaching or housing semiconductor components and other discrete devices that are part of the power electronics system. Furthermore, the ability to co-fire the ferrite with dielectric and conductor materials allows for the incorporation of embedded passives in the multilayer structure to create hybrid power electronic circuits. Overall this thick film material set offers a unique approach to making hybrid power electronics and could potentially allow a size reduction for many commercial dc-dc converter and other power electronic circuits.

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5 Results
5 Results