Platinum Diffusion Barrier Breakdown in a-Si/Au Eutectic Wafer Bonding Proposed for publication in IEEE Transactions on Components and Packing Technologies. Henry, Michael D.; Ahlers, Catalina A. Abstract not provided. More Details TYPE Journal Article YEAR 2012 OSTI
A new Wafer-level Packaging Technology for MEMS with Hermetic Micro-environment Olsson, Roy H.; Nordquist, Christopher N.; Peterson, T.C.; Shul, Randy J.; Ahlers, Catalina A.; Plut, Thomas A.; Patrizi, G.A.; Chanchani, Rajen C. Abstract not provided. More Details TYPE Conference YEAR 2011 OSTI
A New Wafer-Level Packaging Technology for MEMS with Hermetic Micro-Environment Chanchani, Rajen C.; Nordquist, Christopher N.; Olsson, Roy H.; Peterson, T.C.; Shul, Randy J.; Ahlers, Catalina A.; Plut, Thomas A.; Patrizi, G.A. Abstract not provided. More Details TYPE Conference YEAR 2011 OSTI