Circuit board operating shapes and failure identification using a Laser Doppler Velocimeter
Abstract not provided.
Abstract not provided.
Dynamic thermography is a promising technology for inspecting metallic and composite structures used in high-consequence industries. However, the reliability and inspection sensitivity of this technology has historically been limited by the need for extensive operator experience and the use of human judgment and visual acuity to detect flaws in the large volume of infrared image data collected. To overcome these limitations new automated data analysis algorithms and software is needed. The primary objectives of this research effort were to develop a data processing methodology that is tied to the underlying physics, which reduces or removes the data interpretation requirements, and which eliminates the need to look at significant numbers of data frames to determine if a flaw is present. Considering the strengths and weakness of previous research efforts, this research elected to couple both the temporal and spatial attributes of the surface temperature. Of the possible algorithms investigated, the best performing was a radiance weighted root mean square Laplacian metric that included a multiplicative surface effect correction factor and a novel spatio-temporal parametric model for data smoothing. This metric demonstrated the potential for detecting flaws smaller than 0.075 inch in inspection areas on the order of one square foot. Included in this report is the development of a thermal imaging model, a weighted least squares thermal data smoothing algorithm, simulation and experimental flaw detection results, and an overview of the ATAC (Automated Thermal Analysis Code) software that was developed to analyze thermal inspection data.