Publications

Abstract not provided.

In this late-start Tier I Seniors Council sponsored LDRD, we have designed, simulated, microfabricated, packaged, and tested ion traps to extend the current quantum simulation capabilities of macro-ion traps to tens of ions in one and two dimensions in monolithically microfabricated micrometer-scaled MEMS-based ion traps. Such traps are being microfabricated and packaged at Sandia's MESA facility in a unique tungsten MEMS process that has already made arrays of millions of micron-sized cylindrical ion traps for mass spectroscopy applications. We define and discuss the motivation for quantum simulation using the trapping of ions, show the results of efforts in designing, simulating, and microfabricating W based MEMS ion traps at Sandia's MESA facility, and describe is some detail our development of a custom based ion trap chip packaging technology that enables the implementation of these devices in quantum physics experiments.

Abstract not provided.

Qualification of microsystems for weapon applications is critically dependent on our ability to build confidence in their performance, by predicting the evolution of their behavior over time in the stockpile. The objective of this work was to accelerate aging mechanisms operative in surface micromachined silicon microelectromechanical systems (MEMS) with contacting surfaces that are stored for many years prior to use, to determine the effects of aging on reliability, and relate those effects to changes in the behavior of interfaces. Hence the main focus was on 'dormant' storage effects on the reliability of devices having mechanical contacts, the first time they must move. A large number ({approx}1000) of modules containing prototype devices and diagnostic structures were packaged using the best available processes for simple electromechanical devices. The packaging processes evolved during the project to better protect surfaces from exposure to contaminants and water vapor. Packages were subjected to accelerated aging and stress tests to explore dormancy and operational environment effects on reliability and performance. Functional tests and quantitative measurements of adhesion and friction demonstrated that the main failure mechanism during dormant storage is change in adhesion and friction, precipitated by loss of the fluorinated monolayer applied after fabrication. The data indicate that damage to the monolayer can occur at water vapor concentrations as low as 500 ppm inside the package. The most common type of failure was attributed to surfaces that were in direct contact during aging. The application of quantitative methods for monolayer lubricant analysis showed that even though the coverage of vapor-deposited monolayers is generally very uniform, even on hidden surfaces, locations of intimate contact can be significantly depleted in initial concentration of lubricating molecules. These areas represent defects in the film prone to adsorption of water or contaminants that can cause movable structures to adhere. These analysis methods also indicated significant variability in the coverage of lubricating molecules from one coating process to another, even for identical processing conditions. The variability was due to residual molecules left in the deposition chamber after incomplete cleaning. The coating process was modified to result in improved uniformity and total coverage. Still, a direct correlation was found between the resulting static friction behavior of MEMS interfaces, and the absolute monolayer coverage. While experimental results indicated that many devices would fail to start after aging, the modeling approach used here predicted that all the devices should start. Adhesion modeling based upon values of adhesion energy from cantilever beams is therefore inadequate. Material deposition that bridged gaps was observed in some devices, and potentially inhibits start-up more than the adhesion model indicates. Advances were made in our ability to model MEMS devices, but additional combined experimental-modeling studies will be needed to advance the work to a point of providing predictive capability. The methodology developed here should prove useful in future assessments of device aging, however. Namely, it consisted of measuring interface properties, determining how they change with time, developing a model of device behavior incorporating interface behavior, and then using the age-aware interface behavior model to predict device function.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

There exists a wide variety of important applications for micro- and meso-scale mechanical systems in the commercial and defense sectors, which require high-strength materials and complex geometries that cannot be produced using current MEMS fabrication technologies. Micromilling has great potential to fill this void in MEMS technology by adding the capability of free form machining of complex 3D shapes from a wide variety and combination of traditional, well-understood engineering alloys, glasses and ceramics. Inefficiencies in micromilling result from the relationships between a cutting tool's breaking strength, the applied cutting force, and the metal removal rate. Because machining times in mesofeatures scale inversely to the part size, a feature 1/10th as large will take 10 times as long to machine. Also, required chip sizes of 1 m or less are cut with tools having edge radius of 2-3 m, the cutting edge effectively has a highly negative rake angle, cutting forces are increased significantly causing chip loads to be further reduced and the machining takes even longer than predicted above. However, cutting forces do not increase with cutting speed, so faster spindles with reduced tool runout are the path to achieve efficient mesoscale milling. This research explored the development of new ultra-high speed micromilling spindles. A novel air-bearing spindle design is discussed that will run at very high speeds (450,000 rpm) and provide very minimal runout allowing the best use of micromilling cutters and reducing overall machining time drastically. Two generations of this spindle design were completed; one with an air bearing supported tool shaft and one with a novel rolling element bearing supported tool shaft. Both designs utilized friction-drive systems that relied on diameter differences between the drive wheel (operating at speeds up to 90,000 rpm) and the tool shaft to achieve high rotational tool speeds. Runout, stiffness, and machining tests were conducted with the spindle designs and though they both showed promise for ultra-high speed machining, runout issues in the friction drive and in the stock tools kept the system from achieving sustained machining capability.

Abstract not provided.

The goal of this project was to identify a viable, non-destructive methodology for the detection of cracks in electrically poled piezoelectric ceramics used in neutron generator power supply units. The following methods were investigated: Impedance Spectroscopy, Scanning Acoustic Microscopy, Lock-in Thermography, Photo-acoustic Microscopy, and Scanned Vicinal Light. In addition to the exploration of these techniques for crack detection, special consideration was given to the feasibility of integrating these approaches to the Automatic Visual Inspection System (AVIS) that was developed for mapping defects such as chips, pits and voids in piezoelectric ceramic components. Scanned Vicinal Light was shown to be the most effective method of automatically detecting and quantifying cracks in ceramic components. This method is also very effective for crack detection in other translucent ceramics.

The three-year LDRD ''CNC Micromachines'' was successfully completed at the end of FY02. The project had four major breakthroughs in spatial motion control in MEMS: (1) A unified method for designing scalable planar and spatial on-chip motion control systems was developed. The method relies on the use of parallel kinematic mechanisms (PKMs) that when properly designed provide different types of motion on-chip without the need for post-fabrication assembly, (2) A new type of actuator was developed--the linear stepping track drive (LSTD) that provides open loop linear position control that is scalable in displacement, output force and step size. Several versions of this actuator were designed, fabricated and successfully tested. (3) Different versions of XYZ translation only and PTT motion stages were designed, successfully fabricated and successfully tested demonstrating absolutely that on-chip spatial motion control systems are not only possible, but are a reality. (4) Control algorithms, software and infrastructure based on MATLAB were created and successfully implemented to drive the XYZ and PTT motion platforms in a controlled manner. The control software is capable of reading an M/G code machine tool language file, decode the instructions and correctly calculate and apply position and velocity trajectories to the motion devices linear drive inputs to position the device platform along the trajectory as specified by the input file. A full and detailed account of design methodology, theory and experimental results (failures and successes) is provided.

Document is the final report for PSP project No. 14402-10-02 entitled ''Improved Manufacturing of MC4531 Mold Bodies Using High-Speed Machining (HSM)''. The basic physics of high speed machining is discussed in detail including multiple vibrational mode machining systems (milling and turning) and the effect of spindle speed regulation on maximizing the depth of cut and metal removal rate of a machining operation. The topics of cutting tests and tap tests are also discussed as well as the use of the HSM assistance software ''Harmonizer''. Results of the application of HSM to the machining of encapsulation molds are explained in detail including cutting test results, new tool speeds and feeds, dimensional and surface finish measurements and a comparison to the original machining operations and cycle times. A 38% improvement in cycle time is demonstrated while achieving a 50% better surface finish than required.

In PKM Machines, the Cartesian position and orientation of the tool point carried on the platform is obtained from a kinematic model of the particular machine. Accurate positioning of these machines relies on the accurate knowledge of the parameters of the kinematic model unique to the particular machine. The parameters in the kinematic model include the spatial locations of the joint centers on the machine base and moving platform, the initial strut lengths, and the strut displacements. The strut displacements are readily obtained from sensors on the machine. However, the remaining kinematic parameters (joint center locations, and initial strut lengths) are difficult to determine when these machines are in their fully assembled state. The size and complexity of these machines generally makes it difficult and somewhat undesirable to determine the remaining kinematic parameters by direct inspection such as in a coordinate measuring machine. In order for PKMs to be useful for precision positioning applications, techniques must be developed to quickly calibrate the machine by determining the kinematic parameters without disassembly of the machine. A number of authors have reported techniques for calibration of PKMs (Soons, Masory, Zhuang et. al., Ropponen). In two other papers, the authors have reported on work recently completed by the University of Florida and Sandia National Laboratories on calibration of PKMs, which describes a new technique to sequentially determine the kinematic parameters of an assembled parallel kinematic device. The technique described is intended to be used with a spatial coordinate measuring device such as a portable articulated CMM measuring arm (Romer, Faro, etc.), a Laser Ball Bar (LBB), or a laser tracker (SMX< API, etc.). The material to be presented is as follows: (1) methods to identify the kinematic parameters of 6--6 variant Stewart platform manipulators including joint center locations relative to the workable and spindle nose, and initial strut lengths, (2) and example of the application of the method, and (3) results from the application of the technique.