Publications

Abstract not provided.

Abstract not provided.

Abstract not provided.

This work combines focused ion beam sputtering and ultra-precision machining as a first step in fabricating metal alloy microcomponents. Micro-end mills having ∼25 μm diameters are made by sputtering cobalt M42 high-speed steel and C2 micrograin tungsten carbide tool blanks. A 20 keV focused gallium ion beam is used to define a number of cutting edges and tool end clearance. Cutting edge radii of curvature are less than or equal to 0.1 μm. Micro-end mill tools having 2, 4 and 5 cutting edges successfully machine millimeter long trenches in 6061-T4 aluminum, brass, 4340 steel and polymethyl methacrylate. Machined trench widths are approximately equal to the tool diameters, and surface roughnesses (Ra) at the bottom of micromachined features are ∼200 nm. Microtools are robust and operate for more than 6 h without fracture. Results from ultra-precision machining aluminum alloy at feed rates as high as 50 mm/minute and an axial depth of 1.0 μm are included. © 2001 Elsevier Science Inc.

Commercial focused ion beam (FIB) systems are commonly used to image integrated circuits (ICS) after device processing, especially in failure analysis applications. FIB systems are also often employed to repair faults in metal lines for otherwise functioning ICS, and are being evaluated for applications in film deposition and nanofabrication. A problem that is often seen in FIB imaging and repair is that ICS can be damaged during the exposure process. This can result in degraded response or out-right circuit failure. Because FIB processes typically require the surface of an IC to be exposed to an intense beam of 30--50 keV Ga{sup +} ions, both charging and secondary radiation damage are potential concerns. In previous studies, both types of effects have been suggested as possible causes of device degradation, depending on the type of device examined and/or the bias conditions. Understanding the causes of this damage is important for ICS that are imaged or repaired by a FIB between manufacture and operation, since the performance and reliability of a given IC is otherwise at risk in subsequent system application. In this summary, the authors discuss the relative roles of radiation damage and charging effects during FIB imaging. Data from exposures of packaged parts under controlled bias indicate the possibility for secondary radiation damage during FIB exposure. On the other hand, FIB exposure of unbiased wafers (a more common application) typically results in damage caused by high-voltage stress or electrostatic discharge. Implications for FIB exposure and subsequent IC use are discussed.