Publications

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Fiber Bragg gratings (FBGs) are well-suited for embedded sensing of interfacial phenomena in materials systems, due to the sensitivity of their spectral response to locally non-uniform strain fields. Over the last 15 years, FBGs have been successfully employed to sense delamination at interfaces, with a clear emphasis on planar events induced by transverse cracks in fiber-reinforced plastic laminates. We have built upon this work by utilizing FBGs to detect circular delamination events at the interface between epoxy films and alumina substrates. Two different delamination processes are examined, based on stress relief induced by indentation of the epoxy film or by cooling to low temperature. We have characterized the spectral response pre-and post-delamination for both simple and chirped FBGs as a function of delamination size. We show that delamination is readily detected by the evolution of a non-uniform strain distribution along the fiber axis that persists after the stressing condition is removed. These residual strain distributions differ substantially between the delamination processes, with indentation and cooling producing predominantly tensile and compressive strain, respectively, that are well-captured by Gaussian profiles. More importantly, we observe a strong correlation between spectrally-derived measurements, such as spectral widths, and delamination size. Our results further highlight the unique capabilities of FBGs as diagnostic tools for sensing delamination in materials systems.

Abstract not provided.

Abstract not provided.

Internal residual stresses and overall mechanical properties of thermoset resins are largely dictated by the curing process. It is well understood that fiber Bragg grating (FBG) sensors can be used to evaluate temperature and cure induced strain while embedded during curing. Herein, is an extension of this work whereby we use FBGs as a probe for minimizing the internal residual stress of an unfilled and filled Epon 828/DEA resin. Variables affecting stress including cure cycle, mold (release), and adhesion promoting additives will be discussed and stress measurements from a strain gauge pop-off test will be used as comparison. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000.

Abstract not provided.

Abstract not provided.

Abstract not provided.

Abstract not provided.