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The mechanical performance of Sn-Pb solder joints on LTCC substrates

Welding Journal

Vianco, Paul T.; Williams, S.; Kilgo, Alice C.; McKenzie, Bonnie B.; Price, W.; Guerrero, E.

The assembly of ceramic components often uses soldering technologies to attach metal structures to the ceramic base material. Because many suitable solder alloys do not readily wet and spread on ceramics, a metallization layer is deposited on the latter to support wetting and spreading by the molten solder for completion of the joint The metallization layer must be sufficiently robust to retain its integrity through the soldering process as well as not negatively impact the long-term reliability of the joint A study was performed to evaluate the mechanical properties of solder joints made to a 0.200Ti/W-40Cu-2.0Pt-0.375Au (pm) thin-film metallization deposited on low-temperature co-fired ceramic (LTCC) base materials. The solder joints were made with the 63Sn-37Pb solder (wt-%, abbreviated Sn-Pb). A pin pull test was developed to measure the tensile strength of the solder joint as a function of soldering parameters. Failure mode analysis was a critical metric for assessing the roles of interfaces, bulk solder, and the ceramic on mechanical performance. The Sn-Pb solder joints experienced a nominal strength loss with increased severity of the soldering process parameters. The strength decline was attributed to changes in the solder joint microstructure, and not degradation to the thin film structures.

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Effect of thermal annealing on microstructure evolution and mechanical behavior of an additive manufactured AlSi10Mg part

Journal of Materials Research

Yang, Pin Y.; Rodriguez, Mark A.; Deibler, Lisa A.; Jared, Bradley H.; Griego, James J.M.; Kilgo, Alice C.; Allen, Amy A.; Stefan, Daniel K.

The powder-bed laser additive manufacturing (AM) process is widely used in the fabrication of three-dimensional metallic parts with intricate structures, where kinetically controlled diffusion and microstructure ripening can be hindered by fast melting and rapid solidification. Therefore, the microstructure and physical properties of parts made by this process will be significantly different from their counterparts produced by conventional methods. This work investigates the microstructure evolution for an AM fabricated AlSi10Mg part from its nonequilibrium state toward equilibrium state. Special attention is placed on silicon dissolution, precipitate formation, collapsing of a divorced eutectic cellular structure, and microstructure ripening in the thermal annealing process. These events alter the size, morphology, length scale, and distribution of the beta silicon phase in the primary aluminum, and changes associated with elastic properties and microhardness are reported. The relationship between residual stress and silicon dissolution due to changes in lattice spacing is also investigated and discussed.

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Gold-Tin Solder Wetting Behavior for Package Lid Seals

Journal of Electronic Packaging, Transactions of the ASME

Vianco, Paul T.; Kilgo, Alice C.; McKenzie, Bonnie B.

This study examined the cause of nonwetted regions of the gold (Au) finish on iron-nickel (Fe-Ni) alloy lids that seal ceramic packages using the 80Au-20Sn solder (wt %, abbreviated Au-Sn) and their impact on the final lid-to-ceramic frame solder joint. The Auger electron spectroscopy (AES) surface and depth profile techniques identified surface and through-thickness contaminants in the Au metallization layer. In one case, the AES analysis identified background levels of carbon (C) contamination on the surface; however, the depth profile detected Fe and Ni contaminants that originated from the plating process. The Fe and Ni could impede the completion of wetting and spreading to the edge of the Au metallization. The Au layer of lids not exposed to a Au-Sn solder reflow step had significant surface and through-thickness C contamination. Inorganic contaminants were absent. Subsequent simulated reflow processes removed the C contamination from the Au layer without driving Ni diffusion from the underlying solderable layer. An Au metallization having negligible C contamination developed elevated C levels after exposure to a simulated reflow process due to C contamination diffusing into it from the underlying Ni layer. However, the second reflow step removed that contamination from the Au layer, thereby allowing the metallization to support the formation of lid-to-ceramic frame Au-Sn joints without risk to their mechanical strength or hermeticity.

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Interface reactions responsible for run-out in active brazing: Part 1

Welding Journal

Vianco, Paul T.; Walker, Charles A.; De Smet, Dennis J.; Kilgo, Alice C.; McKenzie, Bonnie B.; Grant, Richard P.

The run-out phenomenon was observed in Ag-Cu-Zr active braze joints made between the alumina ceramic and Kovar™ base material. Run-out introduces a significant yield loss by generating functional and/or cosmetic defects in brazements. A prior study identified a correlation between run-out and the aluminum (Al) released by the reduction/oxidation reaction with alumina and aluminum's reaction with the Kovar™ base material. A study was undertaken to understand the fundamental principles of run-out by examining the interface reaction between Ag-xAl filler metals (x = 2,5, and 10 wt-%) and Kovar™ base material. Sessile drop samples were fabricated using brazing temperatures of 965° (T769°F) or 995°C 0823°F) and times of 5 or 20 min. The correlation was made between the degree of wetting and spreading by the sessile drops and the run-out phenomenon. Wetting and spreading increased with Al content (x) of the. Ag-xAl filler metal, but was largely insensitive to the brazing process parameters. The increased Al concentration resulted in higher Al contents of the (Fe, Ni, Co)xAly reaction layer. Run-out was predicted when the filler metal has a locally elevated Al content exceeding 2-5 wt-%. Several mitigation strategies were proposed, based upon these findings.

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3D RoboMET Characterization

Madison, Jonathan D.; Susan, D.F.; Kilgo, Alice C.

The goal of this project is to generate 3D microstructural data by destructive and non-destructive means and provide accompanying characterization and quantitative analysis of such data. This work is a continuing part of a larger effort to relate material performance variability to microstructural variability. That larger effort is called “Predicting Performance Margins” or PPM. In conjunction with that overarching initiative, the RoboMET.3D™ is a specific asset of Center 1800 and is an automated serialsectioning system for destructive analysis of microstructure, which is called upon to provide direct customer support to 1800 and non-1800 customers. To that end, data collection, 3d reconstruction and analysis of typical and atypical microstructures have been pursued for the purposes of qualitative and quantitative characterization with a goal toward linking microstructural defects and/or microstructural features with mechanical response. Material systems examined in FY15 include precipitation hardened 17-4 steel, laser-welds of 304L stainless steel, thermal spray coatings of 304L and geological samples of sandstone.

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Results 1–25 of 74
Results 1–25 of 74