The use of an electrochemical dissolution process is shown to remove the recast layer contamination from the surfaces of electrical-discharge-machining cut components, as well as the interior exposed surfaces of the structure. The solution chemistry, cell potential, and exposure time are all relevant interdependent variables. Optimization of the electrode geometry should be made for each type of component. For the case of Cu-Zn recast contamination of 300-series alloy components, surface composition analysis indicates that complete electrochemical dissolution is achieved using a dilute solution of nitric acid (HNO3). For example, electrochemical dissolution of the Cu-Zn recast is accomplished at 1.2 V cell potential using a 20% nitric solution and an exposure time of 4 h. The use of a nitric acid bath was specifically chosen since it’s chemically compatible and will not degrade the host alloy or the component. In sum, an electrochemically driven dissolution process can be tailored to remove of the recast contamination without affecting the integrity of the host component structure and its dimensional tolerances.
The mechanical behavior of Ti-6Al-4V produced by additive manufacturing processes is assessed as based on a model derived from the Kocks–Mecking relationship. A constitutive parameter cb is derived from a linear Kocks–Mecking relationship for the microstructure that is characteristic of the work hardening behavior. The formulation for cb is determined by considering the plastic strain between the strengths at the proportional limit and the plastic instability. In this way, the model accommodates the variation in work hardening behavior observed when evaluating material as produced and tested along different orientations. The modeling approach is presented and evaluated for the case of Ti-6Al-4V additively manufactured materials as tested under quasi-static uniaxial tension. It is found that different test specimen orientations, along with postbuild heat treatments, produce a change in the microstructure and plasticity behavior which can be accounted for in the corresponding change of the cb values.
The mechanical behavior of Ti-6Al-4V produced by additive manufacturing processes is assessed based on a formulation developed from the Kocks-Mecking relationship. A constitutive parameter derived for the microstructure is characteristic of the work hardening behavior determined by the plastic strain between the proportional limit and the strength at the instability point. The varied plasticity behavior associated with surface and build direction effects can be evaluated with this approach as presented for the case of Ti-6Al-4V under uniaxial tension.
There are many synthesis methods through phase space to produce nanostructures in metals. Condensation methods with rapid solidification are extensively explored from the gas or liquid phase. In particular, electrodeposition using pulsed currents favors continuous nucleation in the processing of structures to produce free-standing sheets as well as protective coatings for surfaces. An analysis approach used to develop the method for refining the structure and surface finish for nanocrystalline gold-copper alloy coatings relates the energy in each deposition pulse to the constituent grain size that forms during growth. Application is now pursued to evaluate a select determination of the grain size for nanocrystalline nickel foils synthesized by pulsed electrodeposition. The mechanical behaviors of hardness and rate-sensitivity of strength are assessed as function of grain size.
The synthesis of metal foils with unique surface features such as waves and steps is of interest for use as payloads in targets for laser-driven physics experiments under dynamic loading conditions. Changes to the surface features are used to quantify the effects of the material strength during the deformation at high-strain rate high pressure. A traditional path to produce these target features is by precision machining processes using diamond tools. Limitations are encountered since many of the materials of interest and the size of the surface features are not often compatible with conventional machining-process methods. An alternative method to produce targets with unique surface features is through vapor synthesis. Two general approaches are taken - one is by replicating the features from the surface of a substrate mandrel, whereas the second is by using hard masks with timed exposure to the deposition vapor. In these approaches, postdeposition removal of a release layer yields a free-standing target with the desired surface features. Specific cases are presented for the physical vapor deposition of copper, aluminum, iron, vanadium, and tantalum to form targets with multiple layers, steps, and sinusoidal surface waves.
The reduced elastic modulus of a material is measured with a nanoindenter probe that is operated in the tapping mode. The resonant frequency of a freely oscillating cantilever is reduced when contact is made between the indenter tip and surface under investigation. It's shown using elasticity theory that the elastic deformation is a function of the indenter tip radius. A deeper penetration within the elastic range can change the tip radius, and introduce an error of 10% in calculating the reduced elastic modulus.
The decomposition of a one-dimensional composition wave in Cu-Ni(Fe) nanolaminate structures is quantified using X-ray diffraction to assess kinetics of the interdiffusion process for samples aged at room temperature for 30 years. Definitive evidence for growth to the composition modulation within the chemical spinodal is found through measurement of a negative interdiffusivity for each of sixteen different nanolaminate samples over a composition wavelength range of 2.1-10.6 nm. A diffusivity value Ď of 1.77 × 10-24 cm2·s-1 is determined for the Cu-Ni(Fe) alloy system, perhaps the first such measurement at a ratio of melt temperature to test temperature that is greater than 5. The anomalously high diffusivity value with respect to bulk diffusion is attributed to the nanolaminate structure that features paths for short-circuit diffusion through interlayer grain boundaries.