Publications
The effects of process parameters on injection-molded PZT ceramics part fabrication- compounding process rheology
Solid solutions of lead-based perovskites are the backbone materials of the piezoelectric components for transducer, actuator, and resonator applications. These components, typically small in size, are fabricated from large sintered ceramic slugs using grinding and lapping processes. These operations increase manufacturing costs and produce a large hazardous waste stream, especially when component size decreases. To reduce costs and hazardous wastes associated with the production of these components, an injection molding technique is being investigated to replace the machining processes. The first step in the new technique is to compound an organic carrier with a ceramic powder. The organic carrier is a thermoplastic based system composed of a main carrier, a binder, and a surfactant. Understanding the rheology of the compounded material is necessary to minimize the creation of defects such as voids or cavities during the injection-molding process. An experiment was performed to model the effects of changes in the composition and processing of the material on the rheological behavior. Factors studied included: the surfactant of the organic carrier system, the solid loading of the compounded material, and compounding time. The effects of these factors on the viscosity of the material were investigated.