Publications

Stress and strain modeling of low temperature cofired ceramic (LTCC) seal frame and lid

Krueger, Daniel; Porter, John; Peterson, K.A.

Low temperature cofired ceramic (LTCC) is established as an excellent packaging technology for high reliability, high density microelectronics. LTCC multichip modules (MCMs) comprising both 'surface mount' and 'chip and wire' technologies provide additional customization for performance. Long term robustness of the packages is impacted by the selection of seal frame and lid materials used to enclose the components inside distinct rooms in LTCC MCMs. An LTCC seal frame and lid combination has been developed that is capable of meeting the sealing and electromagnetic shielding requirements of MCMs. This work analyzes the stress and strain performance of various seal frame and lid materials, sealing materials, and configurations. The application for the MCM will impact selection of the seal frame, lid, and sealing materials based on this analysis.