Publications

SOI substrate removal for SEE characterization: Techniques and applications

Shaneyfelt, Marty R.; Schwank, James R.; Dodd, Paul E.; Stevens, Jeffrey S.; Vizkelethy, Gyorgy; Swanson, Scot E.; Dalton, Scott M.

Techniques for removing the back substrate of SOI devices are described for both packaged devices and devices at the die level. The use of these techniques for microbeam, heavy-ion, and laser testing are illustrated. © 2012 IEEE.