Publications
SEMI Modeling and Simulation Roadmap
With the exponential growth in the power of computing hardware and software, modeling and simulation is becoming a key enabler for the rapid design of reliable Microsystems. One vision of the future microsystem design process would include the following primary software capabilities: (1) The development of 3D part design, through standard CAD packages, with automatic design rule checks that guarantee the manufacturability and performance of the microsystem. (2) Automatic mesh generation, for 3D parts as manufactured, that permits computational simulation of the process steps, and the performance and reliability analysis for the final microsystem. (3) Computer generated 2D layouts for process steps that utilize detailed process models to generate the layout and process parameter recipe required to achieve the desired 3D part. (4) Science-based computational tools that can simulate the process physics, and the coupled thermal, fluid, structural, solid mechanics, electromagnetic and material response governing the performance and reliability of the microsystem. (5) Visualization software that permits the rapid visualization of 3D parts including cross-sectional maps, performance and reliability analysis results, and process simulation results. In addition to these desired software capabilities, a desired computing infrastructure would include massively parallel computers that enable rapid high-fidelity analysis, coupled with networked compute servers that permit computing at a distance. We now discuss the individual computational components that are required to achieve this vision. There are three primary areas of focus: design capabilities, science-based capabilities and computing infrastructure. Within each of these areas, there are several key capability requirements.