Publications
Role of alumina phase and size in tungsten CMP
The role of the alumina particle phase and size on polish rate and process temperature was studied to elucidate removal mechanisms involved in tungsten CMP using potassium iodate-based slurries. Additional work including polishing of blanket PETEOS and titanium films, and polishing of M1 to V1 to M2 electrical test structures was performed to determine the performance of the various aluminas in production CMP. The polish rate of tungsten was highest with alpha alumina. Delta/theta and gamma alumina showed lower polish rates. Tungsten and PETEOS polish rates increased with particle size. Only alpha alumina was able to clear the titanium barrier stack. The size of the alpha alumina did not effect the electrical characteristics of short loop electrical test structures.