Publications
Reduced order models for thermal analysis : final report : LDRD Project No. 137807
This LDRD Senior's Council Project is focused on the development, implementation and evaluation of Reduced Order Models (ROM) for application in the thermal analysis of complex engineering problems. Two basic approaches to developing a ROM for combined thermal conduction and enclosure radiation problems are considered. As a prerequisite to a ROM a fully coupled solution method for conduction/radiation models is required; a parallel implementation is explored for this class of problems. High-fidelity models of large, complex systems are now used routinely to verify design and performance. However, there are applications where the high-fidelity model is too large to be used repetitively in a design mode. One such application is the design of a control system that oversees the functioning of the complex, high-fidelity model. Examples include control systems for manufacturing processes such as brazing and annealing furnaces as well as control systems for the thermal management of optical systems. A reduced order model (ROM) seeks to reduce the number of degrees of freedom needed to represent the overall behavior of the large system without a significant loss in accuracy. The reduction in the number of degrees of freedom of the ROM leads to immediate increases in computational efficiency and allows many design parameters and perturbations to be quickly and effectively evaluated. Reduced order models are routinely used in solid mechanics where techniques such as modal analysis have reached a high state of refinement. Similar techniques have recently been applied in standard thermal conduction problems e.g. though the general use of ROM for heat transfer is not yet widespread. One major difficulty with the development of ROM for general thermal analysis is the need to include the very nonlinear effects of enclosure radiation in many applications. Many ROM methods have considered only linear or mildly nonlinear problems. In the present study a reduced order model is considered for application to the combined problem of thermal conduction and enclosure radiation. The main objective is to develop a procedure that can be implemented in an existing thermal analysis code. The main analysis objective is to allow thermal controller software to be used in the design of a control system for a large optical system that resides with a complex radiation dominated enclosure. In the remainder of this section a brief outline of ROM methods is provided. The following chapter describes the fully coupled conduction/radiation method that is required prior to considering a ROM approach. Considerable effort was expended to implement and test the combined solution method; the ROM project ended shortly after the completion of this milestone and thus the ROM results are incomplete. The report concludes with some observations and recommendations.