Publications
Radiation-induced charge trapping in thin Al2O3/SiOxNy/Si(100) gate dielectric stacks
We examine the total-dose radiation response of capacitors and transistors with stacked Al{sub 2}O{sub 3} on oxynitride gate dielectrics with Al and poly-Si gates after irradiation with 10 keV X-rays. The midgap voltage shift increases monotonically with dose and depends strongly on both Al{sub 2}O{sub 3} and SiO{sub x}N{sub y} thickness. The thinnest dielectrics, of most interest to industry, are extremely hard to ionizing irradiation, exhibiting only {approx}50 mV of shift at a total dose of 10 Mrad(SiO{sub 2}) for the worst case bias condition. Oxygen anneals are found to improve the total dose radiation response by {approx}50% and induce a small amount of capacitance-voltage hysteresis. Al{sub 2}O{sub 3}/SiO{sub x}N{sub y} dielectrics which receive a {approx}1000 C dopant activation anneal trap {approx}12% more of the initial charge than films annealed at 550 C. Charge pumping measurements show that the interface trap density decreases with dose up to 500 krad(SiO{sub 2}). This surprising result is discussed with respect to hydrogen effects in alternative dielectric materials, and may be the result of radiation-induced hydrogen passivation of some of the near-interfacial defects in these gate dielectrics.