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Liquefaction and flow behavior of a thermally decomposing removable epoxy foam

Erickson, Kenneth L.; Trujillo, Steven M.; Thompson, Kyle R.; Sun, Amy C.; Hobbs, Michael L.; Dowding, Kevin J.

The investigation of the liquefaction and flow behavior of a thermally decomposing removable epoxy foam (REF) was discussed. It was concluded that the behavior of REF, can vary greatly depending on both physical and thermal boundary conditions as well as on decomposition chemistry. It was shown that the foam regression away from a heated surface generally involves two moving boundaries, a fluid-solid interface and a fluid-vapor interface. During thermal decomposition, the physical and chemical behaviors of the foams were coupled and can significantly affect heat transfer rates to the encapsulated units.