Publications
Improved isolation for LTCC transceiver modules using full-tape-thickness features
Electromagnetic shielding (EMS) requirements become more demanding as isolation requirements exceed 100dB in advanced S-band transceiver designs. Via-hole fences have served such designs well in low temperature cofired ceramic (LTCC) modules when used in 2-3 rows, depending on requirements. Replacing these vias with slots through the full thickness of a tape layer has been modeled and shown to improve isolation. We expand on a technique for replacing these rows of full tape thickness features (FTTF) with a single row of stacked walls which, by sequential punching, can be continuous, providing a solid Faraday cage board element with leak-free seams. We discuss the material incompatibilities and manufacturing considerations that need to be addressed for such structures and show preliminary implementations. We will compare construction of multilayer and single layer designs.