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Improved etch resistance of ZEP 520A in reactive ion etching through heat and ultraviolet light treatment

Czaplewski, David A.; Tallant, David T.; Patrizi, G.A.; Wendt, J.R.

The authors have developed a treatment process to improve the etch resistance of an electron beam lithography resist (ZEP 520A) to allow direct pattern transfer from the resist into a hard mask using plasma etching without a metal lift-off process. When heated to 90 C and exposed for 17 min to a dose of approximately 8 mW/cm{sup 2} at 248 nm, changes occur in the resist that are observable using infrared spectroscopy. These changes increase the etch resistance of ZEP 520A to a CF{sub 4}/O{sub 2} plasma. This article will document the observed changes in the improved etch resistance of the ZEP 520A electron beam resist.