Publications
Future challenges for MEMS failure analysis
MEMS processes and components are rapidly changing in device design, processing, and, most importantly, application. This paper will discuss the future challenges faced by the MEMS failure analysis as the field of MEMS (fabrication, component design, and applications) grows. Specific areas of concern for the failure analyst will also be discussed. MEMS components are extremely diverse in their application and function. Failure analysts will have to be equally diverse and/or multidisciplinary in their analysis of these devices. Many tools and techniques developed from the IC industry have been used for MEMS FA, but more MEMS-specific FA toolsets have to be developed for diagnosis of these failure mechanisms. Many of the devices discussed in this paper have global issues associated with failure analysis. Many non destructive techniques must be developed to assess the failure mechanisms. Tools and techniques that can perform these functions on a larger scale will also be required. To achieve this, industry will have to work with academia and government institutions to create the knowledge base required for tool and technique development for global and local defect localization.