Publications
Full tape thickness features for new capabilities in LTCC
Full tape thickness features (FTTF) using conductors, high K and low K dielectrics, sacrificial volume materials, and magnetic materials are useful as both technically and cost-effective approaches to multiple needs in laminate microelectronic and microsystem structures. Lowering resistance in conductor traces of all kinds, raising Q-factors in coils, and enhancing EMI shielding in RF desingns are a few of the modern needs. By filling with suitable dielectric compositions one can deliver embedded capacitors with an appropriate balance between mechanical compatibility and safety factor for fabrication. Similar techniques could be applied to magnetic materials without wasteful manufacturing processes when the magnetic material is a small fraction of the overall circuit area. Finally, to open the technology of unfilled volumes for radio frequency performance as well as microfluidics and mixed cofired material applications, the full tape thickness implementation of sacrificial volume materials is also considered. We discuss implementations of FTTF structures and discuss technical problems and the promise such structures hold for the future.