Publications

Failure analysis and process verification of high density copper ICs used in multi-chip modules (MCM)

Walraven, J.A.; Jenkins, Mark W.; Simmons, Tuyet N.; Levy, James E.; Jensen, Sara E.; Jones, Adam J.; Edwards, Eric E.; Banz, James A.; Cole, Edward I.

Manufacturing of integrated circuits (ICs) using a split foundry process expands design space in IC fabrication by employing unique capabilities of multiple foundries and provides added security for IC designers [1] Defect localization and root cause analysis is critical to failure identification and implementation of corrective actions. In addition to split-foundry fabrication, the device addressed in this publication is .comprised of 8 metal layers, aluminum test pads, and tungsten thru-silicon vias (TSVs) making the circuit area > 68% metal. This manuscript addresses the failure analysis efforts involved in root cause analysis, failure analysis findings, and the corrective actions implemented to eliminate these failure mechanisms from occurring in future product.