Publications

Direct write of metals and functional materials for three-dimensional interconnects and antennas

Clem, Paul G.; Carroll, James F.; Cook, Adam W.; Branson, Eric D.; Apblett, Christopher A.

Recent advances in nanoparticle inks have enabled inkjet printing of metal traces and interconnects with very low (100-200°C) process temperatures. This has enabled integration of printable electronics such as antennas and radio frequency identification (RFID) tags with polyimide, teflon, PCBs, and other low temperature substrates. We discuss here printing of nanoparticle inks for three dimensional interconnects, and the apparent mechanism of nanoparticle ink conductivity development at these low process temperatures.