Publications
Development of a removable conformal coating through the synthetic incorporation of Diels-Alder thermally reversible adducts into an epoxy resin
An epoxy-based conformal coating with a very low modulus has been developed for the environmental protection of electronic devices and for stress relief of those devices. The coating was designed to be removable by incorporating thermally-reversible Diels-Alder (D-A) adducts into the epoxy resin utilized in the formulation. The removability of the coating allows us to recover expensive components during development, to rebuild during production, to upgrade the components during their lifetime, to perform surveillance after deployment, and it aids in dismantlement of the components after their lifetime. The removability is the unique feature of this coating and was characterized by modulus versus temperature measurements, dissolution experiments, viscosity quench experiments, and FTIR. Both the viscosity quench experiments and the FTIR measurements allowed us to estimate the equilibrium constant of the D-A adducts in a temperature range from room temperature to 90 °C. © 2007 American Chemical Society.