Publications
Development of a novel technique to assess the vulnerability of micro-mechanical system components to environmentally assisted cracking
Microelectromechanical systems (MEMS) will play an important functional role in future DOE weapon and Homeland Security applications. If these emerging technologies are to be applied successfully, it is imperative that the long-term degradation of the materials of construction be understood. Unlike electrical devices, MEMS devices have a mechanical aspect to their function. Some components (e.g., springs) will be subjected to stresses beyond whatever residual stresses exist from fabrication. These stresses, combined with possible abnormal exposure environments (e.g., humidity, contamination), introduce a vulnerability to environmentally assisted cracking (EAC). EAC is manifested as the nucleation and propagation of a stable crack at mechanical loads/stresses far below what would be expected based solely upon the materials mechanical properties. If not addressed, EAC can lead to sudden, catastrophic failure. Considering the materials of construction and the very small feature size, EAC represents a high-risk environmentally induced degradation mode for MEMS devices. Currently, the lack of applicable characterization techniques is preventing the needed vulnerability assessment. The objective of this work is to address this deficiency by developing techniques to detect and quantify EAC in MEMS materials and structures. Such techniques will allow real-time detection of crack initiation and propagation. The information gained will establish the appropriate combinations of environment (defining packaging requirements), local stress levels, and metallurgical factors (composition, grain size and orientation) that must be achieved to prevent EAC.