Publications

Acceleration models, constitutive equations, and reliability of lead-free solders and joints

Lau, John; Dauksher, Walter; Vianco, Paul T.

A set of acceleration models for lead-free solder joints is proposed and discussed in this study. Useful equations for the acceleration models, life distribution, and failure rate are also provided. Furthermore, methods for selecting the acceleration factor are discussed. In addition, non-linear 3D creep analyses of the 256-pin plastic ball grid array PCB (printed circuit board) assembly are presented. The solder joints are made of 95.5wt%Sn-3.9wt%Ag-0.6wt%Cu lead-free solder. The lead-free results will be compared to those with Sn-Pb solder joints.