Cured Properties G’ vs TempCTE vs TempYoung’s Modulus at 23CBulk Modulus at 23CAdhesive Failure at 23C Composition: 100 pbw Sylgard 184 base resin from Dow Corning10 pbw Sylgard 184 curing agent from Dow Corning10 pbw 3M A16 glass microballoonscured 16 hours at 71C