Advanced Packaging

The development of enabling photonic/electronic microsystems requires more than the invention of new and unique devices and structures. These devices must be individually packaged and interconnected to function together as an integrated system that can communicate effectively with the macro external world. One must understand the application requirements to anticipate and address a number of multidisciplinary engineering challenges. To maximize chances of success, packaging, assembly, and integration should be considered as early as possible.

Sandia staff members have many decades of experience developing not only first-of-a-kind R&D devices, but also high-reliability devices for space and national defense applications, as well as commercial products. Just a sample of recent and current projects includes high-speed, high-resolution X-ray cameras, remote sensors for space deployment, a variety of quantum devices operated at cryogenic temperatures, and autonomous chemical microsensor systems. We can help evaluate a variety of packaging and integration options, anticipating and addressing manufacturability, rework, thermal management, and materials compatibility issues. Strategic partnerships within Sandia as well as with other national laboratories, universities, and private industry enable the development and implementation of advanced microsystems packaging solutions with the greatest value

Trusted Packaging Capabilities